wire bonding silicon vertical capacitor wbsc0504 22nf (50v) 935.142.624.522 key features ? full compatible to monolithic ceramic capacitors ? low profle ? ultra high stability of capacitance value; ? temperature <1% (-55 to +150c) ? voltage < 0.1 % / v ? negligible capacitance loss through ageing ? custom sizes, values, shapes, tolerances and higher voltage ? low leakage current down to 100pa key applications ? any demanding applications, such as medical, aerospace, automotive industrial. ? applicable for standard wire bonding approach ( ball and wedge) ? high reliability applications ? decoupling / filtering / charge pump (ie. pacemakers, defbrillators) ? downsizing 2 & 4 hellesdon park road, norwich, norfolk, nr6 5dr +44 (0)1603 788967 www.micross.com chipcomponents@micross.com pb the ipdia technology is the most appropriate solution for chip on board, chip on foil, chip on glass, chip on ceramic, flip chip and embedded applications, when designers are looking at utmost decoupling behaviours. this silicon based technology is rohs compliant and compatible with lead free refow soldering process. part number 935.132. b. 2 s. u. xx breakdown size: unit: value ie. 10nf/0303 case (wbsc type) 935.142.620.510 voltage: 0 = 0303 5 = 0302 0 = 10f 5 = 1n 4 = 11v 1 = 0202 6 = 0503 1 = 0.1p 6 = 10n 7 = 30v 2 = 0101 7 = 0402 2 = 1p 7 = 0.1u 3 = 0404 8 = 0201 3 = 10p 8 = 1u 4 = 0504 4 = 0.1n 9 = 10u parameters value capacitance range 10pf to 22nf capacitance tolerances 15% operating temperature range -55c to 150c storage temperatures -70c to 165c temperature coefcient <1%, from -55c to +150c breakdown voltage (bv) 150, 50, 30 capacitance variation vs. rvdc 0.1% i v (from 0 v to rvdc) equivalent serial inductor (esl) max 100ph equivalent serial resistor (esr) max 100m? insulation resistance 100g? 16v from -55 to 150c ageing negligible, < 0.001% / 1000h reliability fit < 0.017 parts / billion hours, rvdc, from -55 to 150c capacitor height max 250m
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